Low Temperature, Low Cost Fabrication of Functional Materials, Structures and Systems
Finding substitutes for critical minerals, developing materials for clean energies and lowering manufacturing cost are some of the current challenges in terms of materials processing.
While lowering the processing temperature of functional materials is important to minimize costs since high temperature is often required to promote the reactions, it is a key aspect as well, when compatibility between materials is necessary. For example, embedding components when the density of current discrete components soldered on the surface of Printed Circuit Board (PCB) is reaching the limit, requires a drastic reduction of the synthesis temperature of oxide materials.
Within this context we have been studying and developing processes to decrease the processing temperature of functional materials, using hydrothermal synthesis and modified sol gel (diphasic precursors) and a combination of low temperature solution based, to make functional materials compatible with low melting temperature substrates such as organic, metallic or glass substrates.